The system is controlled by Steeplechase, an 8-axis MEI DSP motion control card and Allen Bradley Devicenet I/O. Citect and Visual Basic applications supplement the HMI. An X/Y linear stage along with an angular axis is used to position silicon wafers for processing. A DVT camera is used to obtain wafer position information allowing compensation for the slight variations in placement for the tooling, which is crucial for high-accuracy processing.